Frost & Sullivan confers Product Innovation Award on DSM

The 2009 Frost & Sullivan European Product Innovation of the Year Award in the field of high performance polymers for electronics was presented to DSM Engineering Plastics for Stanyl ForTii, the first new polymer that meets the current market trends of miniaturisation and convergence of electronic devices.

The product offers advantages including dimensional stability, improved performance, environmental benefits, cost benefits, strength and chemical resistance, and ease of processing. DSM’s Stanyl ForTii extends the performance range of high performance polyamides; this increases the performance-to-cost ratio for both electronics and automotive market needs.

Formerly known as PA4T, this new halogen-free polymer combines important features, namely high mechanical, electrical and high temperature performance. The product’s balance of properties such as enhanced dimensional stability, compatibility with lead free reflow soldering, high stiffness, and mechanical strength at high temperatures meets the needs of the market, says the company.

It is characterised by a high melting point of 325 °C, a high glass transition temperature of 125 °C, a high heat deflection temperature of 310 °C and comparative tracking index of 600 V (PLC level 0), fulfils the second best moisture sensitivity level (MSL JEDEC 2) while offering a flow higher than any halogen free polyphthalamide.

With the highest stiffness amongst all LCPs, PPAs and PPS in the temperature range of reflow soldering, the product has a very low warpage change before and after reflow, making it an ideal fit to solve issues related to co-planarity. The product also boasts high mechanical toughness, high weld line strength and an enhanced resistance to abrasion.

In addition, Stanyl ForTii is RoHS compliant and entirely halogen and red phosphorous free. It also has high cost benefits with an increase in throughput and yield, and lower total cost than LCP, says the company.

Furthermore, Stanyl ForTii can be moulded using conventional equipment. With regard to applications, it is suited for lead free Surface Mount Technology, high temperature dip soldering, eutectic bonding, packages of light emitting diodes and full electrical or hybrid automobiles.